AMD today announced immediate availability of the AMD Sempron 210U and 200U processors for embedded systems. These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD's Direct Connect Architecture. These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance,” said Buddy Broeker, director, Embedded Product Marketing, AMD. “Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design.”
These AMD Sempron processors are specifically designed with unique computing features and a thin, compact form factor to help enable new and uncompromising designs. The AMD Sempron 200U and 210U processors are packaged in a smallfootprint, lidless 812-ball BGA (Ball Grid Array) package. This enables small form factor and rugged designs to be created with optimal thermal dissipation utilizing a soldered down ASB1 device. The AMD Sempron 200U and 210U processors are well suited for designs including enterprise-class thin client systems, point of sale kiosks, digital signage, ruggedized systems for military aero or other field implementations, telecommunications and networking devices, gaming machines and industrial controls with these models supporting extended longevity.
Customers can further streamline development by pairing the new AMD Sempron processors with the AMD M690E chipset.
Additionally, for those solutions that need extreme performance graphics the ATI Radeon E2400 discrete GPU can be incorporated into the platform. This discrete GPU offers support for Microsoft DirectX 10.0 and OpenGL 2.0 and like the AMD Sempron 200U and 210U processors, delivers a compact physical size to accommodate shrinking embedded system form factors.
Product features and benefits:
- Featuring AMD’s innovative Direct Connect Architecture for leading-edge performance by providing separate, dedicated high-speed links between processor and memory, processor and I/O, and I/O to memory, to enable predictability in real-time applications
- HyperTransport technology helps boost overall system performance through a dedicated high-speed, low-latency I/O interface
- AMD Digital Media Xpress technology designed to be compatible with the largest installed base of multimedia enhanced software, taking 3D and graphics to new levels for medical imaging, gaming, kiosk, and point-of-sale applications
- Simultaneous 32- and 64-bit performance, designed to be compatible with Microsoft Windows Vista
- Enhanced Virus Protection to increase the reliability of your network-connected applications
Embedded systems based on the AMD Sempron 210U and 200U processors are also available from iBASE, aValue, EVOC, Gigabyte and Inventec while additional AMD embedded customers are expected to bring systems to market in 2009.
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